1、體積更小；Miniature volume.    2、漏磁小，不產生耦合，性高；      No cross  coupling between inductors due to  low magnetic  shield            and high reliability.    3、無引線，不產生跟蹤性，適合高密度表面貼裝；      No lead, ideal for high density SMT installation, with no directionality.                                 4、優良的可焊性及耐熱沖擊性，適合波峰焊及回流焊。      Superior solder ability and resistance to soldering  heat,  ldeal for         wave or reflow soldering.  

 1、在同樣的尺寸下較插裝磁珠可產生較高的阻值；     Under the same size，the multilayer chip beads produce higher impedance than plug-in beads.  2、與傳統的磁珠不同，片式磁珠無引線，只要簡單的安裝到PCB板上就可抑制EMI和RFI；     These chip beads have substantial EMI.RFI suppression by simply   mounting them onto PCB. 3、磁珠的形狀和尺寸都合EIA標準，可以利用SMT設備進行自動貼裝。      No lead, ideal for high density SMT installation, with no directionality.                              4、優良的可焊性及耐熱沖擊性，適合波峰焊及回流焊。      Superior solder ability and resistance to soldering heat,  ldeal for wave or reflow soldering.