Scanning Acoustic Microscopy, commonly referred to as SAM or SAT (Scanning Acoustic Tomography) is unparalleled in its ability to spot delaminations, cracks and other anomalies non-destruively. Not only does acoustic microscopy dete the failures but it also can provide the specific location of the problem. Sonix SAMs high resolution images and advanced diagnostic tools are used to:

• Diagnose device failures and discover failure "root causes"
• Monitor produion sampling
• Qualify new package or produion designs
• Research new materials or processes

The Sonix Advantage

The purchase of a Scanning Acoustic Microscope (SAM) is a major decision. A primary consideration in the purchase process is the system must be capable of producing the desired benefits for years to come. In a world of constant technological advances, knowing the "true" architeure of a produ is the key to reducing obsolescence, allowing for cost-effeive upgrades, and reducing down time through serviceability. Sonix utilizes state-of-the-art technology that ensures your investment meets current and future expeations. Below is a listing of our line of SAM systems currently available for a variety of semiconduor inspeion needs.

• Dial System
• High Resolution Imaging
• Precision Hardware
• High-Frequency Inspeion
• Advanced Software Features
• Unprecedented Ease of Use

PRODUS

ECHO:

New from Sonix only-make set up and testing EASY by using the unique interaive touch screen and joystick controls right at the tool.

Echo-The universal inspeion tool for produion, failure ysis and development.

Sonix ECHO can dete defes as all as 0.05 micron and is an excellent tool for bump deteion,stacked die inspeion, complex Flipchip inspeion and more traditonal plastic packages.

SonixTM transducers range in frequency from 10MHz through 300MHz and are designed to address all tes of applications and materials.

Other Key Features

Reduced tank height (for improved ergonomics)

Maximum 360° Visibility (for ease of use)

Salanted tank bottom ( for complete draining)

Touch screen and joystick (for ease of use)

Compa and robust system Design ( for low maintenance)

Welded unibody frame (for improved platform stability)

Simultaneous pulse echo and through tranission options (quick defe deteion)

Large scan area (for multiple trays or larger samples)

Transducer based Z-axis (moves transducer instead of tray fixture)

ECHO VS?

To identify the allest and most subtle defes in leading-edge packaged microeleronic applications, ECHO VS includes standard features such as heated water for optimum acoustic coupling, Flexible TAMI for efficient capture of the most useful data, Waveform Averaging for an improved signal-to-noise ratio, ICEBERG for improved image quality and MFCI for enhanced image quality in the most demanding applications. ECHO VS is the ultimate scanning acoustic solution for molded flip chip, CSP, MCM, stacked die, MUF and other advanced packaging technologies.

• Detes air defes as thin as 0.01 micron and spatially resolves defes down to 5 microns.
• Image Enhancement Suite with heated water, waveform simulation and other innovations for industry-leading image quality in advanced packaging applications
• Image optimization for improved image quality in complex molded flip chips (MUF) and packages with polyimide layers
• Waveform averaging for improved signal-to-noise ratio
• Transducers from 15MHz through 300MHz, designed and matched in-house to address all tes of applications and materials
• Stacked Die Imaging (SDI) (optional)
• Molded Flip Chip Imaging (MFCI)

ECHO?

This industry-leading scanning acoustic microscope provides a universal inspeion tool for packaged semiconduor development, produion and failure ysis. With the ability to dete air defes as thin 0.05 micron and spatially resolve defes down to 10 microns, the ECHO is for bump deteion, stacked die (3D packaging) inspeion, complex flip chip inspeion and more traditional plastic packages.

• A robust, universal, inspeion tool for overmolded single-die packages, bare flip chips and other standard applications
• Imaging of defes as all as 10 microns
• Transducers from 15MHz through 200MHz, designed and matched in-house to address all tes of applications and materials
• Stacked Die Imaging (SDI) (optional)
• Molded Flip Chip Imaging (MFCI) (optional)

Vision

Advanced Acoustic Microscopy for stacked die Flip Chips and Bumped Die.

• Failure ysis
• Reliability testing
• Packaging
• Process control.